Elsyca PCB Studio

From panel layout to plating tank.

Predict copper thickness directly from your Gerbers, apply intelligent copper balancing, and validate your plating line in a digital twin — before a single panel is run.

One platform, Six outcomes

Everything designers, CAM and process engineers need to take copper plating from guesswork to a validated, repeatable setup.

See plating behaviour upfront

View copper thickness distribution over every board on your panel.

Automate copper balancing

Generate optimized balancing patterns fast with patented algorithms.

Spot plating risks early

Reveal thickness issues your DFM tools don’t show.

Reduce scrap & stabilize margins

Less rework and fewer out-of-spec panels boost yield.

Get boards delivered faster

Prevent redesign loops and last-minute production surprises.

Choose layouts with confidence

Compare options and enter production with a validated setup.

The 6-step workflow

From Gerber import to production-ready configuration.

1. Start in ECAD or Import Gerbers

Option A: ECAD tool.
Option B: Run PCB Studio via plugin or API scripts.

2. Simulate Thickness

Predicts finished copper thickness distribution across every board on the panel.

3. Identify Plating Risks

See hotspots and thin regions with clear color maps and KPIs. Flag out-of-spec areas before any changes are made.

4. Auto-Balance

Patented algorithm adds dummy copper only where needed. Compare layout options with objective KPIs — uniformity, variance, min/max ratio.

5. Create a Virtual Plating Line

Define panel spacing, quantity, orientation, anode placement and rectifier settings inside a digital twin of your plating line.

6. Finalize & Transfer

Select the best configuration. Send balanced Gerbers back to ECAD, into CAM, or go straight to production with a setup already proven to work.

Capabilities that cover the full cycle

Design & copper balancing

The only PCB DFM software with automated, optimized copper balancing
Single-click balancing in minutes, not an hour of manual work
Side-by-side layout comparison with objective KPIs
Identify the most critical holes for post-production testing
Export balancing results directly in Gerber format

Plating line digital twin

Predict layer thickness along tracks and inside holes
Your real plating tanks & chemistry pre-configured for accuracy
What-if tooling: shields, current robbers, auxiliary anodes
Full panel history across every plating step and flight-bar position
Automated, ISO-ready reports and shareable XPlorer results

Discover the modules

PCBBalance

The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.

PCBPlate

State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.

" Every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs. "

Rick Hartley

RHartley Enterprises

" I'm very impressed by Elsyca's new software that simulates copper finished thickness on plated layers. With a well-balanced design the finished PCB will have less fabrication issues and will electrically perform more consistently. "

Gerry Partida

Director of Technology at Summit Interconnect

" CEC’s use of the Elsyca software has helped to accurately predict the needed plating parameters to increase our first pass yields on new parts. "

Hendrickson

Calumet Electronics