Other Plating Processes


Elsyca has experience with modeling and optimization of a wide range of plating processes, besides the ones mentioned on the dedicated web pages. This includes for example technical gold for pin contacts in the electronics industry, as well as technical tin and silver plating.

Also some recently emerged alloy plating processes like cobalt phosphor or nickel tungsten have been covered by projects . These novel plating processes are very challenging for scaling up to industrial level since the operational current density window for achieving good quality deposits with the proper alloying element content is often quite narrow.

Ionic liquid electrolytes make up a special class of novel plating processes. The interest in ionic liquids is high since they allow depositing refractory metals such as titanium aluminium and tungsten, which is not possible from aqueous solutions. Hence ionic liquids provide a potential cheaper and more environmentally clean alternative to deposit techniques such as plasma spray or chemical vapor deposition techniques (PVD and CVD). The challenges to be faced when plating from ionic liquids include the poor throwing power (due to the low conductivity of these electrolytes), the narrow operational current density window for achieving good quality deposits, and the dependence of the process on bath agitation. Elsyca's Design of Experiment (see also Electrolyte Bath Characterisation) is very well suited for capturing the characteristics of ionic liquid electrolytes. Besides, the fact that Elsyca PlatingMaster can account for local hydrodynamic conditions along the electrode surfaces allows for an accurate modeling of ionic liquid plating processes.

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