Elsyca developed a new exciting technology for PCB CAM engineers to validate the panel layout against plating targets and automatically add copper balancing. This results in panels with a more uniform layer thickness distribution and less plating related production problems.
Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.
Rick Hartley, Principal Engineer, RHartley Enterprises (High Speed and EMI Design Consultant)
Elsyca's operations during COVID-19 pandemic
Despite the extraordinary circumstances, we are keeping operations running, so you can continue to rely on us to support you and your business.