Elsyca Icon

PCB Webinars for CAM engineers

New simulation tools for PCB and panels

Elsyca developed a new exciting technology for PCB CAM engineers to validate the panel layout against plating targets and automatically add copper balancing.
This results in panels with a more uniform layer thickness distribution and less plating related production problems.

Watch the video and read more on the key features & benefits on www.elsycapcbbalance.com

Or find out in one of Robrecht’s webinars how simple it works.  

Please send an email to robrecht.belis@elsyca.com (mentioning the session of your choice) to subscribe and Robrecht will send you a confirmation with the details.

We have planned following sessions of ½ hour + time for questions:

• Thu July 9 at 09:00 CET (English)
• Thu July 9 at 11:00 CET (German)
• Thu July 9 at 16:00 CET (English)
• Thu July 9 at 18:00 CET (English)

• Thu July 23 at 09:00 CET (English)
• Thu July 23 at 11:00 CET (German)
• Thu July 23 at 16:00 CET (English)
• Thu July 23 at 18:00 CET (English)

Next week (in week 29) we are organizing webinars for Process Engineers on Elsyca PCBPlate. Find out more here.

Find out in one of Robrecht’s webinars how simple it works.


Subscribe now
  • Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.

    Rick Hartley, Principal Engineer, RHartley Enterprises
    (High Speed and EMI Design Consultant)