" CEC’s use of the Elsyca software has helped to accurately predict the needed plating parameters to increase our first pass yields on new parts. "
" Copper balance and thickness uniformity reduces scrap rate and improves yield. Nowadays with advanced technology, such software is strongly recommended "
" Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs "
" Elsyca software helps us a lot to identify critical areas already in the design phase. But we also can use it on the shop floor to support our Engineers to predict how different set ups of designs and parameters influence the outcome. Due to this fact we can reduce the amount of trials which also leads to cost reduction. "