Copper plating is a very complex process, that is impacted by the PCB design itself, by the panel layout and by the production configuration.
The ever increasing complexity of the design and request to deliver in shorter amounts of time, are even pushing experts to – and over – their limits.
In order to support the different players in this process, Elsyca developed a new product suite that will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
Request a copy from the white paper and find out how this software will help you in your specific role as a PCB Designer, CAM Engineer or Process Engineer.
Or join one of Robrecht’s webinars and see for yourself how simple it works.