Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics
Elsyca V-PIMS
A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities
Elsyca IRIS
Deep analysis of AC threats supporting efficient mitigation systems computer-aided design
Elsyca CatPro
Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks
Elsyca CPManager
3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations
Elsyca ACTA
Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks
Elsyca PlatingManager
Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity
Elsyca PCBBalance
The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.
Elsyca PCBPlate
State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.
Elsyca ECoatMaster
CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).
Elsyca EPOS
Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.
Elsyca AnodizingManager
State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.
Elsyca CorrosionMaster
CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.
Elsyca LeakageMaster
Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.
Elsyca MeshingMaster
Automatically creates meshes for a variety of applications such as acoustics, CFD, thermal analysis, etc
Elsyca XPlorer
Interactive simulation results viewer for Finite Elements results
Elsyca XPlorer3D
Analyze, Understand and Get Immersed in your results

Safran: Improving PCB design and production cycle performances with upfront simulations.

Based on an interview with Patrice Chetanneau, PCB Senior Expert at Safran

Safran: Improving PCB design and production cycle performances with upfront simulations.

Looking to 2022, expect continued technological progress in everything from electric vehicles to medical technology. The aerospace market is not isolated from these trends. In 2022, the aerospace industry is expected to focus on innovation to develop new technologies and solutions.


From digital thread and smart factory to reusable space components, many engineering challenges are ahead to meet specific aerospace standards such as long lasting durability and extreme thermal conditions. What is common to all of these trends is that every smart device that is used relies on Printed Circuit Boards (PCB). With the extension of smarter devices, the PCB industry experience rising costs as PCB assembly is becoming challenging for those who do not use the latest PCB manufacturing trends.


“People often do not realize how complex it is to design and manufacture PCBs” testifies Patrice Chetanneau, PCB Senior Expert at Safran. “PCB design world is strongly complex, either you like it or you leave it”. “Over the past, the cost constraints have increased. This has pushed the industry to be more productive and effective. This new constraint combined with the great rigor and the technical challenges we have to overcome is what makes our job so intense and interesting!”. 

Among these many technical challenges comes the question of the plating. For PCBs, this is the process used to deposit 20 to 25 μm of copper layer on the board. This is a crucial manufacturing step as it gives the PCB boards its key role in conducting electrical signals in-between components. As PCBs are becoming thinner and more lightweight, ensuring the right width and thickness of copper layers while making sure that PCBs improve their signal integrity, efficiency, heat absorption capability and durability is a design and manufacturing challenge.

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