A unique solution for PCB designers and CAM engineers
Elsyca PCBBalance is the world’s only software for PCB designers and CAM engineers that not only analyzes the copper layer thickness distribution but also includes an automated copper balancing step to optimize your PCB design and panel layout to prime it for the plating process.
By using Elsyca PCBBalance the PCB designer & CAM engineer evaluates the impact of a specific board/panel layout on the copper plating step during the manufacturing.
Jobs with alternative board/panel layouts can be simulated to compare the plating uniformity and select the optimum configuration. Potential plating issues are identified upfront and mitigative actions can be taken such as modifying the board design/panel layout or launching the embedded single-click balancing algorithm to define the optimal copper balancing layout.
By incorporating Elsyca PCBBalance into the DFM process, the designer, CAM and FAB are assured that the optimal panel layout is submitted for production!