The art of predicting layer thickness
The intricate pattern of a printed circuit board has a major impact on the success or failure of achieving within-spec surface uniformity during the plating step in manufacturing.
It is however not easy to predict how your design will ‘translate’ in layer thickness, even for a simple example like the one below. One might spontaneously expect that the layer thickness distribution on the “A” side of the panel will be very symmetric, but it is not due to the L on the backside.
Adding some holes to this makes it even more complicated… and this is an extremely simple layout.