Copper plating is a very complex process, that is impacted by the PCB design itself, by the panel layout and by the production configuration.
The ever increasing complexity of the design and request to deliver in shorter amounts of time, are even pushing experts to – and over – their limits.
In order to support the different players in this process, Elsyca developed a new product suitethat will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.
Rick Hartley, Principal Engineer, RHartley Enterprises (High Speed and EMI Design Consultant)