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Production-proofing PCB copper plating

New simulation tools for PCB and panels

Copper plating is a very complex process, that is impacted by the PCB design itself, by the panel layout and by the production configuration.

The ever increasing complexity of the design and request to deliver in shorter amounts of time, are even pushing experts to – and over – their limits.

In order to support the different players in this process, Elsyca developed a new product suite that will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.

Click on the appropriate link below to find out how this software will help you in your specific role as a PCB Designer, CAM Engineer or Process Engineer.

Request a copy from the white paper or find out in one of Robrecht’s webinars how simple it works.

Find out how this software will help you as a

  • Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.

    Rick Hartley, Principal Engineer, RHartley Enterprises
    (High Speed and EMI Design Consultant)