Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics

Protect

Elsyca V-PIMS

A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities

Elsyca IRIS

Deep analysis of AC threats supporting efficient mitigation systems computer-aided design

Elsyca CatPro

Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks

Elsyca CPManager

3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations

Elsyca ACTA

Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks

Plate

Elsyca PlatingManager

Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity

Elsyca PCBBalance

The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.

Elsyca PCBPlate

State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.

Elsyca ECoatMaster

CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).

Elsyca EPOS

Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.

Elsyca AnodizingManager

State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.

Innovate

Elsyca CorrosionMaster

CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.

Elsyca LeakageMaster

Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.

Elsyca XPlorer

Interactive simulation results viewer for Finite Elements results

Elsyca XPlorer3D

Analyze, Understand and Get Immersed in your results

Upcoming Webinar: Predict Copper Distribution Before You Plate

August 7, 2026

Elsyca Webinar

📅 Thursday, September 24th at 16h CET
📍 Virtual Event

Copper electroplating is one of the most sensitive steps in PCB manufacturing. Small changes in panel layout, load, chemistry, or rectifier settings can flip you from in-spec to scrap, and uneven thickness, hotspots, and under-plated regions stay invisible at the design stage until they surface on the line as cost, delays, and reliability risk.

This session shows how Elsyca PCBStudio lets you predict copper distribution before you plate, walking through a real board from Gerber import to a production-ready, validated setup.

You'll Learn

In this webinar, Elsyca will show how PCBStudio allows you to:

▪️ See finished copper thickness distribution across every board on the panel before production.
▪️ Automate copper balancing with patented algorithms to generate optimized patterns fast.
▪️ Spot plating risks and thickness issues that standard DFM tools don't show.
▪️ Reduce scrap and protect margins with fewer out-of-spec panels and less rework.
▪️ Deliver boards faster by preventing redesign loops and last-minute surprises.
▪️ Compare layout options on objective KPIs and enter production with confidence.

Who Should Attend

🔹 PCB Manufacturing & Process Engineers.
🔹 OEM & PCB Layout Designers.
🔹 CAM and Pre-Production Engineers.
🔹 Quality, Yield & Reliability Leads.
🔹 Plating Line & Production Managers.
🔹 R&D and DFM Specialists.

Save Your Seat Today!

Join us to see how simulation lets you catch plating problems before a single panel is run, cut scrap, and enter production with a setup already proven to work.

➡️ Register here.

pcb pcbdesign plate cae electronics webinar