April 25, 2022

Safran: Improving PCB design and production cycle performances with upfront simulations.

Based on an interview with Patrice Chetanneau, PCB Senior Expert at Safran

From digital thread and smart factory to reusable space components, many engineering challenges are ahead to meet specific aerospace standards such as long lasting durability and extreme thermal conditions. What is common to all of these trends is that every smart device that is used relies on Printed Circuit Boards (PCB). With the extension of smarter devices, the PCB industry experience rising costs as PCB assembly is becoming challenging for those who do not use the latest PCB manufacturing trends.

Learn more https://www.elsyca.com/learn/safran-improving-pcb-design-and-production-cycle-performances-with-upfr...