Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics
Discover Protect
Elsyca V-PIMS
A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities
Elsyca AC & CP Bundle
Model your pipeline network once, then assess AC interference and cathodic protection from the same GIS model. Model Composer builds it, IRIS solves the AC, CatPro solves the DC — no rebuild, no re-entry, one source of truth.
Elsyca IRIS
Deep analysis of AC threats supporting efficient mitigation systems computer-aided design
Elsyca CatPro
Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks
Elsyca CPManager
3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations
Elsyca ACTA
Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks
Plate
Elsyca PCBStudio
Predict copper thickness directly from your Gerbers, apply intelligent copper balancing, and validate your plating line in a digital twin — before a single panel is run.
Elsyca PlatingManager
Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity
Elsyca ECoatMaster
CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).
Elsyca EPOS
Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.
Elsyca AnodizingManager
State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.
Innovate
Elsyca CorrosionMaster
CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.
Elsyca LeakageMaster
Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.
Elsyca XPlorer
Interactive simulation results viewer for Finite Elements results
Elsyca XPlorer3D
Analyze, Understand and Get Immersed in your results
Predict Copper Distribution Before You Plate
Discover how simulation lets you catch plating problems before a single panel is run, cut scrap, and enter production with a setup already proven to work.
Content overview
Copper electroplating is one of the most sensitive steps in PCB manufacturing. Small changes in panel layout, load, chemistry, or rectifier settings can flip you from in-spec to scrap, and uneven thickness, hotspots, and under-plated regions stay invisible at the design stage until they surface on the line as cost, delays, and reliability risk.
This webinar shows how Elsyca PCBStudio lets you predict copper distribution before you plate, walking through a real board from Gerber import to a production-ready, validated setup.
This video will allow you to:
✔ See finished copper thickness distribution across every board on the panel before production.
✔ Automate copper balancing with patented algorithms to generate optimized patterns fast.
✔ Spot plating risks and thickness issues that standard DFM tools don't show.
✔ Reduce scrap and protect margins with fewer out-of-spec panels and less rework.
✔ Deliver boards faster by preventing redesign loops and last-minute surprises.
✔ Compare layout options on objective KPIs and enter production with confidence.