Resistive Contacting


Related software



In the initial stages of the electroplating process, the internal resistivity of plastic parts plays an important role. This internal resistivity is a function of the initial metal seed layer thickness and decreases over time with the growth of the electrodeposited metal layers. Time-stepped simulations now allow to predict the occurrence of high current density zones and thus related layer quality issues.

Key features are:

  • the Resistive Contacting module enables to achieve an optimal contact clip arrangement
  • no limitation in the number or location of the contact clips
  • user-definable current or voltage ramp profile
  • also the internal resistivity of plastic current robbers is accounted for
  • the decrease in resistivity over time is calculated and taken into account for the subsequent time step
  • an embedded movie functionality allows to see the evolution over time of deposit thickness and other results

Liked what you see? Let's work together!