In the initial stages of the electroplating process, the internal resistivity of plastic parts plays an important role. This internal resistivity is a function of the initial metal seed layer thickness and decreases over time with the growth of the electrodeposited metal layers. Time-stepped simulations now allow to predict the occurrence of high current density zones and thus related layer quality issues.
Key features are:
- the Resistive Contacting module enables to achieve an optimal contact clip arrangement
- no limitation in the number or location of the contact clips
- user-definable current or voltage ramp profile
- also the internal resistivity of plastic current robbers is accounted for
- the decrease in resistivity over time is calculated and taken into account for the subsequent time step
- an embedded movie functionality allows to see the evolution over time of deposit thickness and other results