March 3, 2026
Elsyca Webinar
📅 Tuesday, March 24th at 15h CET
📍 Virtual Event
As PCB architectures evolve toward higher layer counts, finer features, and more demanding reliability requirements, copper plating has become one of the most critical—and most unpredictable—steps in the manufacturing process.
Increasing design complexity often pushes traditional plating processes to their limits, leading to unexpected thickness variations, insufficient via coverage, and costly trial-and-error adjustments on the plating line.
These issues not only impact yield but also slow down customer response times and erode margin on technically challenging projects.
You'll Learn
In this webinar, Elsyca will show how virtual prototyping of PCB copper deposition allows manufacturers to:
▪️ Quantify plating risks of complex PCB designs early in customer discussions and automate copper thieving strategies.
▪️ Optimize existing plating line configurations for more uniform and predictable pattern plating.
▪️ Assess copper deposits in vias, including demanding high‑aspect‑ratio and HDI structures.
▪️ Connect bath characteristics and operating windows directly to deposit performance, enabling more stable production.
Who Should Attend
🔹 CAM Engineers
🔹 Process Engineers
🔹 PCB Manufacturing Engineers
🔹 Quality & Reliability Engineers
🔹 Production & Operations Managers
Save Your Seat Today!
Join us to see how simulation-driven insights can help you improve yield, stabilize quality, and confidently take on more demanding PCB designs.
➡️ Register here.