January 16, 2026
Elsyca at the 2nd Pan-European Electronics Design Conference (PEDC 2026)
Elsyca is pleased to announce its participation in the 2nd Pan-European Electronics Design Conference (PEDC 2026), taking place on January 21–22, 2026, at NH Prague City in Prague, Czech Republic. The conference brings together electronics designers, manufacturing specialists, and technology providers to exchange insights on the latest developments in electronics design and production.
Throughout the event, the Elsyca team — Robrecht Belis, Director Surface Finishing; Diego d’Udekem, Chief Executive Officer; and Reshmaa Selvakumar, Business Developer — will be present at the Elsyca booth to engage with industry peers, discuss regional manufacturing challenges, and explore emerging trends in PCB design and surface finishing technologies.
Technical Presentation
- 𝗧𝗶𝘁𝗹𝗲: Simulation-Driven Insights into Copper Plating and Via Filling
- 𝗦𝗽𝗲𝗮𝗸𝗲𝗿: Robrecht Belis | Director Surface Finishing
- 𝗗𝗮𝘁𝗲 & 𝗧𝗶𝗺𝗲: 22 January 2026 | 15:30 CET
- 𝗣𝗹𝗮𝗰𝗲: Room Zürich 2
The presentation will demonstrate how advanced simulation techniques provide deeper insight into copper plating and via filling processes, enabling improved process optimization, higher reliability, and more informed design and manufacturing decisions in PCB production.
Meet Elsyca at PEDC 2026
- Exhibition: 𝗕𝗼𝗼𝘁𝗵 𝟴 | 21 – 22 January 2026
- Place: 𝗡𝗛 𝗣𝗿𝗮𝗴𝘂𝗲 𝗖𝗶𝘁𝘆 | 𝗣𝗿𝗮𝗴𝘂𝗲, 𝗖𝘇𝗲𝗰𝗵 𝗥𝗲𝗽𝘂𝗯𝗹𝗶𝗰
PEDC 2026 offers a valuable platform for knowledge exchange and collaboration across the electronics manufacturing ecosystem. Elsyca looks forward to connecting with professionals who are shaping the future of PCB design, surface finishing, and digital engineering.
If you are attending PEDC 2026, we would be pleased to meet you at our booth and continue the conversation during the event.