Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics
Discover Protect
Elsyca V-PIMS
A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities
Elsyca IRIS
Deep analysis of AC threats supporting efficient mitigation systems computer-aided design
Elsyca CatPro
Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks
Elsyca CPManager
3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations
Elsyca ACTA
Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks
Plate
Elsyca PlatingManager
Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity
Elsyca PCBBalance
The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.
Elsyca PCBPlate
State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.
Elsyca ECoatMaster
CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).
Elsyca EPOS
Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.
Elsyca AnodizingManager
State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.
Innovate
Elsyca CorrosionMaster
CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.
Elsyca LeakageMaster
Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.
Elsyca MeshingMaster
Automatically creates meshes for a variety of applications such as acoustics, CFD, thermal analysis, etc
Elsyca XPlorer
Interactive simulation results viewer for Finite Elements results
Elsyca XPlorer3D
Analyze, Understand and Get Immersed in your results
Simulation-Driven Insights into Copper Plating and Via Filling
PEDC 2026
Simulation-Driven Insights into Copper Plating and Via Filling (PEDC 2026)
Robrecht Belis; Romain Baudson, Elsyca.
Abstract
Electroplating is used to deposit copper on PCB traces and within vias or through-holes. The resulting layer thickness depends on several factors, starting with the PCB design. Since the active surface—the regions exposed to plating—varies across the panel, thickness distribution is rarely uniform. Via filling adds further complexity. To achieve a fully filled, void-free via, specialized baths are required to promote bottom-up copper growth. As filling progresses, the active surface changes: initially including via walls and bottom, but reducing to the bottom area once the via closes. This shift alters process conditions over time and must be accounted for, especially in HDI boards with high via counts. This presentation will examine these challenges and show how simulation supports accurate prediction of copper thickness.