This two-page case study shows how PCBStudio predicts copper thickness distribution for pattern plating straight from the design data, before a single trial panel is plated. It covers three scales of analysis: the individual board, the six-up production panel, and a full rack in a digital twin of the tank, tooling included. A KPI comparison against a 25 µm target shows mixed balancing raising Cpk from 0.37 to 0.78 and bringing 100% of the area inside the spec band. The case study also shows how side current robbers improve uniformity across a four-panel rack.