Copper plating is a very complex process, that is impacted by the PCB design itself, by the panel layout and by the production configuration. Download File
The ever increasing complexity of the design and request to deliver in shorter amounts of time, are even pushing experts to – and over – their limits.
In order to support the different players in this process, Elsyca developed a new product suite that will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
Request our white paper here and read more about these NEW simulation tools for PCB and panels.