Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics
Discover Protect
Elsyca V-PIMS
A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities
AC & CP Bundle
Model your pipeline network once, then assess AC interference and cathodic protection from the same GIS model. Model Composer builds it, IRIS solves the AC, CatPro solves the DC — no rebuild, no re-entry, one source of truth.
Elsyca IRIS
Deep analysis of AC threats supporting efficient mitigation systems computer-aided design
Elsyca CatPro
Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks
Elsyca CPManager
3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations
Elsyca ACTA
Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks
Plate
Elsyca PlatingManager
Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity
Elsyca PCBBalance
The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.
Elsyca PCBPlate
State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.
Elsyca ECoatMaster
CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).
Elsyca EPOS
Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.
Elsyca AnodizingManager
State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.
Innovate
Elsyca CorrosionMaster
CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.
Elsyca LeakageMaster
Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.
Elsyca XPlorer
Interactive simulation results viewer for Finite Elements results
Elsyca XPlorer3D
Analyze, Understand and Get Immersed in your results
Optimizing Copper Uniformity in Vertical Substrate Plating
KPCA 2026 Awarded
Optimizing Copper Uniformity in Vertical Substrate Plating: SIMMTECH Customer Success Story (KPCA 2026 Awarded)
SIMMTECH, Trinity Engineering and Elsyca.
Content
Based on an award-winning KPCA 2026 paper by SIMMTECH's R&D Group, this two-page story shows how the semiconductor substrate maker used Elsyca PCBPlate as a digital twin diagnostic tool, not just a predictor. The team built a 3D model of one cell of their vertical copper plating line. They then studied three equipment parameters that design drawings miss: clamp conductive exposure, electrolyte level and jig assembly eccentricity. Correcting the electrolyte level alone cut the average deviation between simulation and measurement from 1.24 to 0.67 µm. The fully corrected model matched measurements on a real patterned product at 95.3% across 25 points. It also let the team work backwards from a one-sided thickness bias to the actual jig offset, and eliminate asymmetric thickness variation in new line setups.