Discover our complete solutions portfolio covering Cathodic Protection and Corrosion management - PCB design and plating - Functional and decorative plating - Electrocoating - Acoustics
Elsyca V-PIMS
A revolution in digital PIMS combining Pipeline Corrosion Integrity Management System (PIMS) and computational modeling capabilities
Elsyca IRIS
Deep analysis of AC threats supporting efficient mitigation systems computer-aided design
Elsyca CatPro
Graphical simulation platform for cathodic protection and DC stray current analysis of pipeline networks
Elsyca CPManager
3D CAD-based software simulation platform for the computer-aided design and analysis of cathodic protection installations
Elsyca ACTA
Unique solution offering accurate, disambiguated, and tailored risk ranking report of pipeline networks
Elsyca PlatingManager
Leverage a digital twin of your plating line to predict plating performance and increase manufacturing capacity
Elsyca PCBBalance
The world’s only PCB DFM software that applies automated and optimized copper balancing to your PCB design and panel layout.
Elsyca PCBPlate
State-of-the-art graphical simulation platform for enhancing the plating performance of your PCB panel and pattern plating processes.
Elsyca ECoatMaster
CAD independent software platform for the simulation of the automotive electrocoating process of a body-in-white (BIW).
Elsyca EPOS
Simulate the performances of electropolishing processes based on a virtual mock-up of the electropolishing cell.
Elsyca AnodizingManager
State-of-the-art graphical simulation platform for analyzing the production performance and quality of anodizing processes.
Elsyca CorrosionMaster
CorrosionMaster identifies corrosion hot spots and predicts corrosion rates, enabling engineers to look at alternative material combinations and/or coating systems, or investigate corrosion-mitigating measures.
Elsyca LeakageMaster
Improve vehicles interior acoustic comfort by performing upfront virtual smoke tests.
Elsyca MeshingMaster
Automatically creates meshes for a variety of applications such as acoustics, CFD, thermal analysis, etc
Elsyca XPlorer
Interactive simulation results viewer for Finite Elements results
Elsyca XPlorer3D
Analyze, Understand and Get Immersed in your results

Smart Design: Sustainable solution for automated and optimized Cu balancing

EIPC 2023 - Conference Paper

Smart Design: Sustainable solution for automated and optimized Cu balancing

Smart Design: Sustainable solution for automated and optimized Cu balancing

Agnieszka Franczak, Bart Van den Bossche, Robrecht Belis, Elsyca NV.; Sascha Reuter, Manuel Luschtinetz, Rohde & Schwarz.


PCB manufacturing relies on building a physical PCB from its design, accounting for a set of required specifications. Understanding the design specs is crucial as it has a direct impact on the PCB’s fabrication process, performance and productivity yield rate. One of such specs of interest is copper balancing - copper traces distribution in every layer of the PCB stack-up which provides exceptional electrical and thermal characteristics necessary for signal transmission and heat dissipation. In case the copper distribution is uneven, the mechanical misalignments such as board twists, bow or warpage can occur. Thus, one of the tasks a PCB designer has to perform is to balance the copper traces distribution, so that the mechanical properties can be improved. An optimized copper balance also ensures homogenous copper plating across each PCB layer, creating uniform copper layer thickness on the plates surfaces. This in turn, improves signal transmission and overall PCB performance, provides consistent PCB thickness during lamination and reduces the risk of low-pressure surface areas that may result in re-design. With the recent computer simulation technology development, PCB designers can now perform fully automated and optimized copper balancing activities, making sure their designs are free of re-design risks and fabricated towards required Cu distribution and thickness specs. Furthermore, the Cu balancing tool can be integrated within their design business logic, what creates a desired one button solution. 

This talk will highlight the issues caused by poor Cu balancing at the design stage, the most optimal mitigation strategy to address the issues occurred and the workflow of the integration process, which creates a smart design approach.

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