The aerospace sector seeks alternatives to Cd and Cr(VI) compounds while, at the same time, the surfaces to-be-plated are becoming increasingly complex. The result is that plating to specs is more challenging than ever before.
News & Events
Updates on the latest news and upcoming events
In this white paper, we outline the day-to-day operational challenges and the deficiencies of today’s monitoring and survey practices.
In December 2017, our Elsyca PlatingManager software was covered in the article 'Virtuelle Galvanik spart Kosten und Ressourcen', featured in JOT.
PCB West 2019
For the first time, Elsyca will attend to the Largest Conference and Exhibition for Printed Circuit Board Design, Fabrication and Assembly in the Silicon Valley. You can find us in booth n°107. Elsyca will host a session on "CAE for Upfront DfM and Configuration Validation of PCB Plating Process" on Wednesday, September 11 - we hope you can join us there!
- 09 Sep - 12 Sep
- Santa Clara, CA, USA