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Production-proofing PCB copper plating

Copper plating is a very complex process, that is impacted by the PCB design itself, by the panel layout and by the production configuration. The ever increasing complexity of the design and request to deliver in shorter amounts of time, are even pushing experts to – and over – their limits.

In order to support the different players in this process, Elsyca developed a new product suite that will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.

Click on the appropriate link below to find out how this software will help you in your specific role as a

Elsyca PCBBalance

Elsyca PCBBalance is the world’s only software for PCB designers and CAM engineers that not only analyzes the copper layer thickness distribution but also includes an automated copper balancing step to optimize your PCB design and panel layout to prime it for plating process.

Elsyca PCBBalance
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Elsyca PCBPlate

The state-of-the-art PCB plating simulation platform for PCB DFM and FAB, providing detailed information on copper layer thickness distribution inside the holes and over the different panels on the flight bar.

Elsyca PCBPlate
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New release in 2020

New release in 2020
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