The engineering innovation partner of choice
The people behind the engineering innovation partner of choice.
Johan Deconinck founded Elsyca in 1997 and is chairman of the board of directors. Johan is currently professor at the Brussels University VUB and heads the “Computational Electrochemistry Group" of the department of Electrical Engineering. He manages numerous research projects in the field of electrochemical and electrical engineering, and has worked as an independent industrial consultant and judicial expert at the Trade Court in Brussels. In addition to his academic career, Johan has co-managed several privately held companies. In 2004, he was honoured as "Doctor Honoris Causa" at the Technical University of Cluj-Napoca, Romania.
Jean-Marc Dewilde is Managing Director of Elsyca. Jean-Marc joined Elsyca in 2007 as Vice-President Sales and was entrusted with the general management of the company in 2011. Jean-Marc obtained his MSc in mechanical engineering from Ghent University (UG) and holds a post-graduate in aerospace engineering from the University of Brussels (VUB). He worked as aerospace simulation engineer in ESTEC in The Netherlands, the technical heart of the European Space Agency. Between 1994 and 2007, Jean-Marc held various engineering and management positions at LMS International in Leuven, Belgium. In his last role at LMS, Jean-Marc headed the UK office as regional director.
Elsyca is committed to continuous innovation and invests significantly in research and development.
Our ongoing collaboration with the VUB (Vrije Universiteit Brussel) helps us in expanding the body of knowledge on the fundamentals and science of electrochemical processes as well as continually improving the effectiveness of computer modeling as a design and analysis tool. The partnership with the VUB is evolved through numerous applied research projects.
In recent years, Elsyca has conducted R&D - both internal as well as funded - in several domains.
Elsyca is a partner in the EU Horizon 2020 BeLeadFree project. This project aims to deliver novel Lead-free bearing materials by adopting innovative design & manufacturing. Elsyca’s role in this project mainly consists in developing suited tooling that enables plating different bearing types within specifications while using novel Lead-free plating baths.
Elsyca established a mathematical model to describe AC corrosion. The model includes the time-dependent electrical phenomena, the electrochemical reactions and the mass transport in the defect and the soil. The model shows an excellent agreement with real life test data for a large range of AC and DC process conditions.
Elsyca is instrumental in on-going research for the modeling of galvanic, uniform and localized corrosion and their coupling effects with the purpose of developing an engineering tool fit for designers as well as corrosion experts.
With funding of the RFCS program, Elsyca models the impact on the corrosion activity of the metallic coating compositions for various liquid films (pH, Cl, thickness ...) and to explore how the developed model can be integrated with life time prediction tools for real-life structures.
Elsyca implemented the 'multi-ion transport and reaction' model to extend beyond the scope of the potential model that underpins electrochemical simulations. This new model enables advanced simulations of copper superfilling of microstructures, electrograining of aluminum, co-deposition of different metals and localized corrosion.
To support its electrochemical simulation technology, Elsyca developed a proprietary wrapping and surface / volume meshing approach for complex 3D structures. This technology can be used stand-alone to generate high-quality meshes for applications outside of electrochemistry, such as acoustics, fluid flow and thermal analyses. [link naar relevante website]
Elsyca developed a proprietary process that deposits a 2 micron layer of the copper-indium-gallium precursor in less than 30 seconds with the required composition. A first test with an industry standard selenization process yielded a solar cell efficiency of 4%.
In a collaborative effort with Ucamco and ACB, Elsyca developed a simulation software tool for the prediction and optimization of layer thickness distributions on printed circuit boards, resulting in a significant yield improvement.
This European 7th Framework Program aims to develop a novel copper deposition process based on the use of non-aqueous solvents enabling device scaling beyond the 32 nm technology node. Elsyca's task is to design and simulate a prototype 300mm wafer plating tool for the non- aqueous deposition process.
This European 7th Framework Program aims to develop a next generation Micro-ECM sinking machine for the automotive, aerospace & medical device sectors. The role of Elsyca® is to develop the modeling of the Micro-ECM process to support the process development and upscaling.
With the objective of establishing technical guidelines for the extraction of sheet piles, Elsyca® simulates how the application of electro-osmosis can reduce the pull-out resistance of sheet piles in cohesive soils.
CP Design for the Opti-Ex™ semi-submersible oil rig
Production of highly-decorated chromium plated steering wheel bezel
CP management of multiple pipeline right-of-ways
Seaproof CP design for windfarm transformers
Pipeline CP shielding effect by bridge foundation structure
Corrosion strategy for new offshore windfarm monopile foundations
Electroplating rack design for variety of door handles
Electrocoating simulations for new vehicle programs
Plating simulation for production optimization and engineering design aid
Quality and production increase for copper electroplating of PCBs
Mastering acoustic leakage with the help of Elsyca LeakageMaster
Elsyca is a dynamic company seeking talented people to help us develop and market our computational modeling solutions. Our success depends on our continuing effort to hire the right people with the skills, experience and the desire to grow with the challenges and successes that Elsyca will offer them.
If you are interested in joining our staff, we invite you to send a motivation letter and your resume to email@example.com.
Current job offers
Elsyca is continuously looking for talented and motivated students for a 3 to 6 months internship. Tasks include both project development and validation on Elsyca products.
If you are interested in an internship at Elsyca, please send your motivation letter to firstname.lastname@example.org.