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Elsyca PlatingMaster

Elsyca PlatingMaster is a revolutionary 3D software program for electroplating process simulation and optimization.
 

Elsyca PlatingMaster provides the electroplating engineer the intelligent tool for managing costs, attaining higher productivity, making ecological gains and simultaneously improving customer service & product quality.
 

Elsyca PlatingMaster software guides the engineer through the different simulation stages:
1) CAD creation: Elsyca PlatingMaster creates (or imports from file) the complete geometrical configuration (plating tank, rack and workpiece) using state-of-the art CAD tools
2) Pre-processing: Elsyca PlatingMaster reads the plating bath characteristics from file or database
3) Meshing: Elsyca PlatingMaster automatically meshes your plating tank configuration
4) Boundary conditions: Elsyca PlatingMaster imposes direct or (bipolar) pulsed currents through multiple electrodes
5) Solving: Elsyca PlatingMaster swiftly computes current density and layer thickness distributions over all electrodes in the plating tank configuration
6) Post-processing: Elsyca PlatingMaster has powerful visualisation tools
7) Optimisation: Elsyca PlatingMaster enables optimisation of your plating tank configuration using a limited number of iteration steps
 


Elsyca PlatingMaster Key Features:

  • entirely integrated in SolidWorks® (www.solidworks.com) offering a cost-efficient and user-friendly interface for your CAD product designs and plating tank configuration;
  • file import from numerous CAD packages such as IGES, STEP, CATIA, SAT (ACIS), VDAFS, DXF, PARASOLID, ProE, Inventor, …
  • fast and highly accurate hybrid grid generator, specifically developed for electrochemical simulations purposes;
  • robust and prompt numerical solver calculating potential, current, and layer thickness distributions for complex 3D configurations;
  • powerful visualisation tools with optional output to Tecplot®.

 

Elsyca PlatingMaster Solver Key Features:

  • parameterization of reactor dimensions;
  • imposed potential on different electrode faces;
  • imposed current through one or a collection of electrode faces (includes floating and bipolar electrode modelling);
  • electrode polarization & efficiency defined by linear or Butler-Volmer type relations, or through direct import from experimental data;
  • (bipolar) pulsed current/potential signals.

 

The advanced Elsyca PlatingMaster process optimisation tool enables a speedy analysis of the effect of:

  • screens and current thieves;
  • product masking;
  • product shape and position in rack;
  • shape and position of anodes;
  • total imposed current or potential difference (DC or pulsed);
  • plating time.