In leadframe production, commonly 2 distinct plating processes are used:

• the silver plating (spot plating) to enable die attach and wire bonding,
• the plating of solderable material (e.g. Sn/Pb) on outer leads of a leadframe. The transition to lead free is one the most significant challenges to address.

One of the main challenges is to ensure uniform plating independently of the details of the leadframe, with a high deposition rate. To ensure this, Elsyca offers optimized tooling and plating cell design to ensure maximum throughput with uniform deposition. This is especially relevant when starting with a new plating process or improved configuration.