Many applications exist for metal foils electroplated with different finishes such as nickel, gold or silver. For example:

• antenna inlays for RFID smart labels and tags electrodeposited on a foil;
• adhesion layers electroplated on lead frames.

One of the main problems when developing and exploiting continuous plating processes is that the throughput is governed by the slowest process. In many cases, this is the electroplating process, where the deposition rate can not be increased easily because then the thickness layer uniformity will deteriorate. Therefore an improved design and tooling delivered by Elsyca can easily increase the throughput of a continuous production line by 20%, while maintaining the same uniformity and deposition quality.