Although copper and nickel are usually applied by all over plating, the more precious metals like silver, gold or palladium are selectively plated on only the functional areas of the connector.

An important aspect is to save material by depositing the precious metal evenly on the connector surfaces. The Elsyca technology can provide solutions that ensure an even deposit of precious metals on the selected areas, while ensuring high deposition rate and throughput. As the optimal design is highly dependent on the type of process, the extended experience of Elsyca enables us to provide a custom-made solution which satisfies all requirements.