Advanced Simulations of Copper Layer Thickness Distribution on Printed Circuit Boards

Modeling Strategy for Predicting Current Density Distributions on PCBs and Other Complex Patterns Substrates

3D simulation for MID Plating Processes, MID 2006 Molded Interconnect Devices

A performance simulation tool for bipolar pulsed PCB plating

Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrate

Three-Dimensional Current Density Distribution Simulations

Three-dimensional simulations of current density distributions for patterned wafers and PCB's

Three-dimensional current density distribution simulations for a resistive patterned wafer

Predicting and quantifying the influence of mass transfer on the plating of interconnects

Optimisation of a cupplater reactor for gold deposition on wafers