Elsyca assists companies in the Electronics industry in analyzing and optimizing existing electrochemical processes, as well as developing new technologies hand-in-hand with our customers. We engineer electroplating processes for the manufacturing of leadframes, connectors and film/foil systems. In addition, we developed a dedicated simulation tool SmartPlate for the PCB/PWB business. And last but not least, Elsyca has developed an enabling electrochemical plating solution Elsyca IntelliTool to address the technology challenges in semiconductor manufacturing; a solution that also enhances copper deposition for packaging applications.

In an industry of constant change and intense competition, we are always looking at developing next-generation solutions that set you ahead of the field; our unique numerical modelling and electrochemical simulation technology is fundamental in achieving this.