Recently the following projects have been finalized:

Development of simulation and optimization software for the electroplating of high quality printed circuit boards (PCB/PWB)

Partners: Elsyca, Ucamco and ACB.

The goal of this project is the development of a prototype simulation software tool for the prediction and optimization of layer thickness distributions on PCBs, to develop and investigate what accuracy can be achieved by the simulations of DC and pulsed plating processes in the PCB industry, and what yield improvements can be attained. The benefits for the end-users are:

• production within specifications (less scrap);

• acceleration of the plating process (increased production capacity);

• reduction of energy (electricity) and raw materials (metal and electrolyte);

• faster time-to-market (reduction of trial and error phase).

Optimisation methodology and process technology for realising low-cost, high-precision integrated electronic components by electrochemical pattern replication (IWT)

Partners: Acreo, Replisaurus, Elsyca N.V., TCD Teknologi, SGA

A newly invented technique called Electrochemical Pattern Replication (ECPR) enables direct replication of metal patterns by means of electrochemical deposition from a relief template (an electrochemical stamp). By eliminating all steps of polymer processing related to lithography, the ECPR technology offers a simplified process scheme, improved process control, significant cost and cycle time savings, and reduces organic solvent consumption compared to traditional metallization schemes based on lithography and etching/plating. There is also a considerable contribution to sustainable technology development.

Original Research Objectives: The main task within this project is to simulate the micro scale deposition process to understand better the influence of the different process parameters. In order to do this 2D and 3D Mitrem (diffusion-migration) simulations including electrode shape change will be performed and compared with measurements. Based on these simulations, specifications for the design of the patterns on the wafer can be determined.