In close cooperation with Ucamco, Elsyca recently developed SmartPlate, a dedicated electroplating simulation tool for the printed circuit board (PCB/PWB) industry.

SmartPlate calculates the copper deposition on the surface of the PCB/PWB based on the pattern on the board, the plating tank configuration and the process parameters. Using these simulations, an in-house developed patented approach enables to predict the plating thickness in the through-holes and vias. This allows PCB manufacturers to optimize their production process and to reduce scrap with a maximum of through-holes plated within specifications.

The present version of SmartPlate integrates seamlessly into UCAM (Ucamco), a leading CAM system for the manufacturing of printed circuit boards. This allows the end-users to perform the simulations and optimization of the electroplating process even before production has started. Other commonly used industry formats can also be imported easily into SmartPlate.
 

Please click here to learn more about SmartPlate.