Plating Feasibility is a performance, quality and costs predictive analysis for an electroplating process of a specific part. The Plating Feasibility acts as an electroplating “dry run”, without the requirement of having a physical part, yet based on the specific conditions at the costumer’s plating process and the part to be plated. Hence, based on a limited input concerning geometrical and process parameters, the Elsyca technology predicts upfront the inherent problems encountered when electroplating a complex part or pattern. This provides insights to avoid these problems, by changing the layout, process parameters or tooling.

Elsyca offers the Plating Feasibility for all types of plating processes.

For instance

• when plating a new type of leadframe a Plating Feasibility will show the zones with increased and reduced deposit, and will guide you towards an adapted shielding design;
• for plating new PCB types, plating feasibility can easily be predicted using SmartPlate.

Please click here to learn more about Plating Feasibility.