Elsyca has developed a patented technology to locally control the voltage/current in an electrolytic cell with the objective of achieving a more uniform layer thickness during an electrochemical metal deposition process: Elsyca IntelliTool. This real-time and dynamic control by Elsyca IntelliTool is based on upfront simulations and optimization. Elsyca IntelliTool can be integrated in new cell designs or can even be integrated in existing applications.

Typical applications include:

• the compensation of the pattern dependency of the electrodeposition for printed circuit boards or patterned wafers and
• the counteraction of the terminal effect when using a thin seed layer in wafer plating.

With this solution, a full dynamic integration in the workflow can now be realized, addressing the technological challenges of new technologies.

Please click here to learn more about Elsyca IntelliTool.